Process for preparing semiconductor device _by forming reinforcing regions to facilitate separation of pellets
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHiroshi Gamo, Shigeru Hokuyo, Takeshi Yamamoto, Takahiko Ichimura
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Abstract
A process for preparing semiconductor pellets from one sheet of a semiconductor wafer is disclosed. In the process of the invention, the semiconductor wafer is divided into a plurality of pellet-forming regions and reinforcing regions are formed between the pellet forming regions and at the peripheral part of the wafer. The reinforcing regions prevent breakage of the wafer without increasing the thickness of the pellets whereby a wafer having a large diameter can be used to obtain many pellets having suitable characteristics from one sheet of the wafer without substantial loss.
Claims8
In a process for preparing semiconductor devices by forming a plurality of semiconductor pellets in one sheet of a semiconductor wafer and dividing the wafer along the boundaries of the semiconductor pellets, an improvement which comprises forming reinforcing regions on said wafer adjacent said plurality of semiconductor pellets and on the periphery of said wafer to thereby divide said plurality of semiconductor pellets into a plurality of completely enclosed and separated regions, with each of said separated regions containing a plurality of said semiconductor pellets wherein said reinforcing regions adjacent said pellets have a specified width, whereby breakage of said sheet of semiconductor wafer is substantially reduced.
Dependencies are inferred from the claim text.