Memory present apparatus
AssigneeHoneywell Information Systems Inc.
InventorsWilliam Panepinto, Jr., Chester M. Nibby, Jr.
Life of this patent
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AssigneeHoneywell Information Systems Inc.
InventorsWilliam Panepinto, Jr., Chester M. Nibby, Jr.
Estimating the term…
A memory subsystem includes at least one up to a number of memory module boards identical in layout and construction. The board includes a number of memory chips which are positioned in a number of physical row locations together providing a predetermined number of addressable contiguous memory locations corresponding to a predetermined increment of memory capacity. The board includes a set of switches whose input terminals are connected to receive predetermined ones of a plurality of address signals. These predetermined signals are coded specifying the segments of memory being accessed. The signals applied to the switch output terminals are logically combined and the resulting signal is applied to a group of memory present circuits connected to receive other ones of the address signals representative of the row of chips being addressed. By altering the set of switches, the group of memory present circuits can be conditioned to generate an output signal for indicating that the same increment is present for accessing within any one of a number of different segments thereby enabling the same board to be used in any available address slot position.
A memory subsystem comprising at least one memory module board coupled to receive a plurality of address signals specifying a memory location to be accessed within said subsystem, said board including a control section and a memory section having a predetermined number of physical row locations of memory chips, said predetermined number of rows of memory chips corresponding to a segment of addressable memory space and each row of chips corresponding to an increment of memory space, said control section including:
A memory module board for providing any one of a number of like segments of addressable memory space within a memory subsystem, said memory module board comprising:
A memory subsystem constructed to facilitate expansion and repair, said subsystem being connected to a bus in common to a processing unit and comprising:
Dependencies are inferred from the claim text.