Molded lead frame dual in line package including a hybrid circuit
AssigneeBurr-Brown Research Corporation
InventorRobert M. Stitt
Life of this patent
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Abstract
A molded dual in line package is disclosed which has at least one cavity in a first major molded surface thereof into which an integrated circuit chip can be mounted and wire bonded. After the circuit is tested and adjusted, the cavity is sealed with a metal plate. Other embodiments are disclosed which include a second cavity in a second major molded surface of the package which may house or contain a second integrated circuit, an epoxy sealer, or a substrate.
Claims1
A molded dual in line package comprising a housing having at least one circuit comprising at least one semiconductor chip, said housing having first and second major surfaces and at least one cavity in said first major surface;
- a first plurality of external electrically conductive leads;
- a second plurality of internal electrically conductive leads coupled to said first plurality of leads and accessible from within said at least one cavity;
- insulating support means within said housing and forming a lower surface of said at least one cavity upon which said at least one circuit is mounted, said at least one circuit being electrically coupled to said second plurality of leads;
- passive circuitry on said support means;
- and
- stainless steel metal cover means having epoxy means for sealing said at least one circuit in said at least one cavity, said passive circuitry is electrically coupled to said semiconductor chip.
Dependencies are inferred from the claim text.