Compressed gaseous materials in a contained volume

Hollow inorganic film forming material microspheres of substantially uniform diameter of 500 to 6,000 microns and of substantially uniform wall thickness of 0.5 to 400 microns and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are free of latent solid or liquid blowing gas materials or gases and the walls of said microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles.

Filamented, hollow inorganic film forming material microspheres having a diameter of 200 to 10,000 microns, having a wall thickness of 0.1 to 1,000 microns and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are connected to each other by filament portions which are continuous with the microspheres and are of the same inorganic film forming material from which the microspheres are made.

Filamented, hollow inorganic film forming material microspheres having a diameter of 500 to 6,000 microns, having a wall thickness of 0.5 to 400 microns and having a contained gas pressure of above 15 p.s.i.g. at ambient temperature, wherein said microspheres are connected to each other by filament portions which are continuous with the microspheres and are of the same inorganic film forming material from which the microspheres are made.

Hollow glass microspheres of substantially uniform diameter of 200 to 10,000 microns and of substantially uniform wall thickness of 0.1 to 1,000 microns and having a contained gas pressure of above 15 p.s.i.g. at ambient temperature, wherein said microspheres are free of latent solid or liquid blowing gas materials or gases and the walls of said microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles.

Hollow glass microspheres of substantially uniform diameter of 500 to 6,000 microns and of substantially uniform wall thickness of 0.5 to 400 microns and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are free of latent solid or liquid blowing gas materials or gases and the walls of said microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles.

Filamented, hollow glass microspheres having a diameter of 200 to 10,000 microns, having a wall thickness of 0.1 to 1,000 microns and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are connected to each other by filament portions which are continuous with the microspheres and are of same inorganic film forming material from which the microspheres are made.

Filamented, hollow glass microspheres having a diameter of 500 to 6,000 microns, having a wall thickness of 0.5 to 400 microns, wherein said microspheres are connected to each other by filament portions which are continuous with the microspheres and are of the same inorganic film forming material from which the microspheres are made.

Hollow inorganic film forming material microspheres having a diameter of 200 to 10,000 microns, having a wall thickness of 0.1 to 1,000 microns, having a thin metal coating deposited on the inner wall surface of the microspheres and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are free of latent solid or liquid blowing gas materials or gases and the walls of said microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles.

Hollow inorganic film forming material microspheres having a diameter of 500 to 6,000 microns, having a wall thickness of 0.5 to 400 microns, having a thin metal coating deposited on the inner wall surface of the microspheres and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are free of latent solid or liquid blowing gas materials or gases and the walls of said microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles.

Hollow glass microspheres having a diameter of 200 to 10,000 microns, having a wall thickness of 0.1 to 1,000 microns, having a thin metal coating deposited on the inner wall surface of the microspheres and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are free of latent solid or liquid blowing gas materials or gases and the walls of said microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles.

Hollow glass microspheres having a diameter of 500 to 6,000 microns, having a wall thickness of 0.5 to 400 microns, having a thin metal coating deposited on the inner wall surface of the microspheres and having a contained gas pressure above 15 p.s.i.g. at ambient temperature, wherein said microspheres are free of latent solid or liquid blowing gas materials or gases and the walls of said microspheres are substantially free of holes, relatively thinned wall portions or sections, sealing tips and bubbles.