Film for heat sealing and process of heat sealing
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsTakeshi Nabeta, Takeshi Masui, Tsuguo Hasegawa
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Abstract
A film and a laminate using the film as a substrate which both are suitable for heat sealing and a process for heat sealing the film and the laminate are disclosed. The film comprises a blend of (I) at least one member selected from the group consisting of (A) elastomeric block copolymers of vinyl-aromatic compounds with conjugated diene compounds, (B) resinous block copolymers of vinyl-aromatic compounds with conjugated diene compounds and (C) vinyl-aromatic resins and/or modified vinyl-aromatic resins, and (II) an olefinic polymer.
Claims14
A film for heat sealing which comprises a blend of [I] at least one member selected from the group consisting of (A) an elastomeric block copolymer containing 10 to 50% by weight of styrene and/or alpha-methyl styrene copolymerized with conjugated dienes, (B) a resinous block copolymer containing 50 to 95% by weight of styrene and/or alpha-methyl styrene copolymerized with conjugated dienes, [II] a styrene-butadiene graft-copolymer, and [III] at least one member selected from the group consisting of ethylene-alpha-olefin random copolymers, ethylene-vinyl acetate copolymers, ethylene-alkyl acrylate copolymers, polypropylene and ethylene-propylene elastomers.
The film of claim 14, wherein the ethylene-alkyl acrylate copolymer is an ethylene-ethyl acrylate copolymer.
Dependencies are inferred from the claim text.