Porous, heat resistant insulating substrates for use in printed circuit boards, printed circuit boards utilizing the same and method of manufacturing insulating substrates and printed circuit boards

A printed circuit board comprising an insulating substrate made up of a porous insulating sheet containing cellulose material as the essential component thereof and at least one resin impregnated insulating sheet bonded to at least one surface of said porous insulating sheet, and electric conductors arranged in a predetermined circuit pattern on the surface of said prepreg, said porous insulating sheet being sufficiently porous to allow gas evolved in said substrate during soldering to readily escape through said porous insulating sheet, said insulating substrate providing a printed circuit board formed therefrom with heat resistance to solder at 260.degree. C. for at least 30 seconds and thus avoid blistering of said printed circuit board.

An insulating substrate for use as a printed circuit board comprising a porous insulating sheet that contains cellulose material as the essential component thereof, said porous insulating sheet being from 1 to 5 mm thick, and one resin impregnated insulating sheet bonded to at least one surface of the porous insulating sheet, said porous insulating sheet being sufficiently porous to allow gas evolved in said substrate during soldering to readily escape through said porous insulating sheet, said insulating substrate providing a printed circuit board formed therefrom with heat resistance to solder at 260.degree. C. for at least 30 seconds and thus avoid blistering of said printed circuit board.

A method of manufacturing an insulating substrate for use as a printed circuit board comprising the steps of superposing a prepreg impregnated with a thermosetting resin on at least one surface of a porous insulating sheet containing cellulose material as the essential component thereof, said insulating sheet being sufficiently porous to allow gas evolved in said substrate during soldering to readily escape through said insulating sheet, and applying heat and pressure to the resulting assembly thereby curing said thermosetting resin and bonding said prepreg to said insulating sheet, and thereby forming an insulating substrate that provides a printed circuit board made therefrom with heat resistance to solder at 260.degree. C. for at least 30 seconds and thus avoid blistering of said printed circuit board.

A method of manufacturing a printed circuit board comprising the steps of superposing a prepreg impregnated with a thermosetting resin on at least one surface of a porous insulating sheet containing cellulose material as the essential component thereof, said insulating sheet being sufficiently porous to allow gas evolved in said substrate during soldering to readily escape through said insulating applying heat and pressure to the resulting assembly to cure the thermosetting resin and to bond the prepreg to said insulating sheet thereby forming an insulating substrate, and forming on the surface of said prepreg electric conductors which are arranged in a predetermined circuit pattern, thereby obtaining a printed circuit board having heat resistance to solder at 260.degree. C. for at least 30 seconds and thus avoid blistering of said printed circuit board.