Back to results
US 4,302,316 AGranted
Non-contacting technique for electroplating X-ray lithography
AssigneeThe Perkin-Elmer Corporation
InventorJames F. Nester
Life of this patent
Estimating the term…
Abstract
An apparatus and method for coating a substrate. An electrically conductive substrate is placed in an electrolytic bath with the surface to be coated facing the anode. The cathode is placed near but not touching the other side of the substrate and an electric potential is applied to both electrodes. Means are provided to prevent electroplating of the cathode.
Claims1
An apparatus for electroplating an electrically conductive substrate, comprising in combination;
- a tank containing a plating solution,
- a liquid-tight housing disposed within said plating solution containing an electrically conductive liquid with said substrate forming one side of said housing,
- said housing freely removable from said tank,
- an anode disposed in said plating solution opposite one surface of said substrate,
- a cathode disposed within said housing adjacent to and fixed relative to the other surface of said substrate,
- said cathode and said substrate being of circular configuration,
- the portion of said housing not formed by said substrate being made of electrically non-conducting material,
- means applying an electrical potential between said anode and cathode for coating said one surface of said substrate without said cathode or housing being coated.
5 more elements
Dependencies are inferred from the claim text.