Process for preparing flexible printed-circuit board
AssigneeHitachi Chemical Company, Ltd.
InventorsShigeo Tachiki, Toshiaki Ishimaru, Nobuyuki Hayashi
Life of this patent
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Abstract
A flexible printed-circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board. The cover layer is formed by laminating a photoprintable, photosensitive layer supported on a flexible support to the surface of a flexible printed-circuit board, exposing the photosensitive layer imagewise to light to form a polymer image in the layer and removing the unexposed areas of the layer to leave an imaged polymer film on the surface of the board. The formation of the cover layer can be easily conducted by a continuous operation.
Claims3
A process for preparing a flexible printed-circuit board which comprises the steps of:
- (1) laminating a photoprintable, photosensitive layer which is supported on a polymer film support, to the surface of a flexible printed-circuit board with a conductor pattern,
- (2) exposing the photoprintable, photosensitive layer imagewise to light either before or after removing the support from the layer,
- (3) removing the unexposed areas of the photoprintable, photosensitive layer to leave an imaged polymer film as a cover layer on the surface of the flexible printed-circuit board.
Dependencies are inferred from the claim text.