US 4,301,958 AGranted

Arrangement for automatically fabricating and bonding semiconductor devices

AssigneeFujitsu Limited

InventorsTatsuo Hatakenaka, Kiyouhei Tamaki, Tetsuo Nanbu

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Abstract

A system for automatically fabricating and bonding semiconductor devices using lead frames and semiconductor chips, which comprises means for supplying a continuous strip of lead frames, an automatic die bonder for mounting semiconductor chips on the lead frames and forming sheets thereof, buffer means for temporarily storing the sheets formed of the lead frames and semiconductor chips mounted thereon, and at least one automatic wire bonder, all of these apparatuses being arranged in a line. The sheets are automatically and successively fed from the automatic die bonder to the buffer means and from the buffer means to the automatic wire bonder by means of a series of automatic conveyor mechanisms.

Claims17

Dependent claims

A system for automatically fabricating and bonding semiconductor devices using lead frames and semiconductor chips, which comprises:

(a) a single automatic die bonder including (i) bonding means for successively mounting semiconductor chips on respective lead frames supplied in a continuous strip, (ii) cutting means for cutting the continuous strip of lead frames into sheets comprised of a given number of lead frames after completion of the chip mounting, and (iii) transport means for conveying the cut sheets;
(b) buffer means operatively connected to said die bonder for temporarily holding the cut sheets of a given number of lead frames supplied thereto from said transport means of said automatic die bonder, said buffer means including (i) means for conveying the cut sheets along a transport path, (ii) at least one magazine storage means for storing said cut sheets provided at an intermediate position along the transport path of said conveying means and having a plurality of sheet-holding racks, and (iii) operating means for positioning said sheet-holding racks of the magazine storage means to a desired position relative to the transport path of said conveying means;
and
(c) a plurality of automatic wire bonders, operatively and successively connected together with the first of said wire bonders being operatively connected to said buffer means, for selectively subjecting unprocessed sheets supplied from said buffer means or the preceding wire bonder to electrical conductor wiring processing or transporting sheets to a succeeding wire bonder, each said automatic wire bonder including (i) main transport conveyor means for conveying sheets fed from said buffer means or the preceding wire bonder along a predetermined transport path, (ii) first transfer conveyor means for selectively supplying unprocessed sheets, which have been fed to said main transport conveyor means, to a wire bonding region, (iii) wire bonding means for wire processing sheets supplied to the wire bonding region, and (iv) second transfer conveyor means for discharging the wire-processed sheets from the wire bonding region to said main transport conveyor means for subsequent transport;
and
wherein said one automatic die bonder, buffer means, and the plurality of automatic wire bonders are connected together along a continuous automated operational line for fabricating and bonding said semiconductor devices at a constant rate.

3 more elements

Dependencies are inferred from the claim text.

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Abstract

A system for automatically fabricating and bonding semiconductor devices using lead frames and semiconductor chips, which comprises:

(a) a single automatic die bonder including (i) bonding means for successively mounting semiconductor chips on respective lead frames supplied in a continuous strip, (ii) cutting means for cutting the continuous strip of lead frames into sheets comprised of a given number of lead frames after completion of the chip mounting, and (iii) transport means for conveying the cut sheets;
(b) buffer means operatively connected to said die bonder for temporarily holding the cut sheets of a given number of lead frames supplied thereto from said transport means of said automatic die bonder, said buffer means including (i) means for conveying the cut sheets along a transport path, (ii) at least one magazine storage means for storing said cut sheets provided at an intermediate position along the transport path of said conveying means and having a plurality of sheet-holding racks, and (iii) operating means for positioning said sheet-holding racks of the magazine storage means to a desired position relative to the transport path of said conveying means;
and
(c) a plurality of automatic wire bonders, operatively and successively connected together with the first of said wire bonders being operatively connected to said buffer means, for selectively subjecting unprocessed sheets supplied from said buffer means or the preceding wire bonder to electrical conductor wiring processing or transporting sheets to a succeeding wire bonder, each said automatic wire bonder including (i) main transport conveyor means for conveying sheets fed from said buffer means or the preceding wire bonder along a predetermined transport path, (ii) first transfer conveyor means for selectively supplying unprocessed sheets, which have been fed to said main transport conveyor means, to a wire bonding region, (iii) wire bonding means for wire processing sheets supplied to the wire bonding region, and (iv) second transfer conveyor means for discharging the wire-processed sheets from the wire bonding region to said main transport conveyor means for subsequent transport;
and
wherein said one automatic die bonder, buffer means, and the plurality of automatic wire bonders are connected together along a continuous automated operational line for fabricating and bonding said semiconductor devices at a constant rate.

3 more elements