Cover mounted multi-columnar semiconductor assembly

A cover mounted multi-columnar semiconductor assembly for mounting to a casing containing a cooling fluid, said assembly comprising:

• a first end plate and a second end plate,
• a shaft fixed at its ends to the centers of respective plates,
• a plurality of columnar arrays of semiconductors spaced apart by solid copper blocks interposed between said semiconductors, with said arrays being installed between said plates,
• the improvement wherein said first end plate constitutes the cover of said casing such that said arrays are disposed within said cooling fluid, and wherein a plurality of spring biased clamping means are carried by said second end plate at circumferentially spaced positions corresponding to said columnar arrays and bear against the ends of said arrays to independently compress said arrays axially from said second end plate in the direction of said first end plate to adjust to the load of the individual columnar arrays, and
• wherein said clamping means comprises for each columnar array, an axially slidable clamping part mounted to said second end plate for sliding movement towards and away from said first end plate along the axis of said columnar arrays, a washer guide disposed at the end of said columnar array and a spring washer interposed between said washer guide and said clamping part, and a screw threaded to said second end plate and having a head contacting the side of said clamping part opposite said spring washer, such that by rotation of said screw, the biasing force acting on said columnar array may be independently varied for a given columnar array.