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US 4,301,190 AGranted
Pretreatment with complexing agent in process for electroless plating
OwnerNathan Feldsteininventor
Life of this patent
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Abstract
Metallic surfaces are imparted to non-conductive or dielectric substrate by an electroless (chemical) coating process comprised contacting said substrate with a composition comprising an adsorption modifier and thereafter coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound.
Claims27
A process for the metallization of an etched non-conductor substrate by electroless or chemical plating comprising;
- a. contacting said substrate with a composition comprising of an adsorption modifier said modifier being a complexing agent and wherein the retention of said adsorption modifier on said substrate provides a path for an increased catalytic site density of the colloidal catalytic product,
- b. contacting said substrate with a colloidal catalytic composition, said composition comprising of non-precious metal which directly or serving as a precursor leads to the catalytic sites which are capable of electroless plating initiation and wherein said metal may be in either elemental state, an alloy, or a compound and mixtures thereof, and
- c. contacting said substrate with a compatible electroless plating bath.
A process for the metallization of a printed-circuitry substrate by electroless or chemical plating comprising the steps of
- a. contacting said substrate with a composition comprising of an adsorption modifier said modifier being a complexing agent wherein the retention of said adsorption modifier on said substrate provides a path for an increased catalytic site density of the colloidal catalytic product,
- b. contacting said substrate with a colloidal catalytic composition, said composition comprising of non-precious metal which directly or serving as a precursor leads to the catalytic sites which are capable of electroless plating initiation and wherein said metal may be in either elemental state, an alloy, or a compound and mixtures thereof, and
- c. contacting said substrate with a compatible electroless plating bath.
Dependencies are inferred from the claim text.