Process for cementing semiconductor discs to carrier plates and product so obtained

A process for cementing a semiconductor disc to a carrier plate, which comprises the steps of:

• first, applying to the carrier plate a layer of a cement solution consisting of
• (a) from 60 to 95 parts by weight of a maleate resin having a melting range (determined according to Kofler) within the temperature range of from 50.degree. to 180.degree. C., the upper limit of the melting range being not more than 20.degree. C. above the cementing temperature to be used, and having a melt viscosity (as determined at 20.degree. C. above the upper limit of the melting range of the resin) within the range of from 1000 to 6000 P, and, complementally,
• (b) from 5 to 40 parts by weight of an additional substance selected from the group consisting of benzil or alpha-naphthol that is substantially miscible with the resin, and has a plasticizing effect on the resin at the chosen cementing temperature and that has a melting point within the range of from 0.degree.-25.degree. C. below the cementing temperature to be used, and
• (c) from 75 to 250 parts by weight, based on the total weight of components (a) and (b) of a solvent for the resin and the plasticizer, the solvent having a boiling point that is lower than the cementing temperature to be used and such that the solvent evaporates at the cementing temperature;
• secondly, heating the carrier plate and layer of cement solution to the cementing temperature which is a temperature within the range of from 50.degree. to 160.degree. C., until the solvent has substantially evaporated from the cement solution;
• thirdly, placing the semiconductor disc onto the cement layer, at the said cementing temperature in such a manner that occlusion of air bubbles between said disc and cementing layer is avoided;
• fourthly, applying pressure to the semiconductor disc to secure it to the cement layer, while the carrier plate and the cement layer are at a temperature within the range of from 30.degree. C. below the cementing temperature to the cementing temperature;
• and
• fifthly, cooling the cement layer in order to allow it to set.