Arrangement for measuring the distance between a metallic workpiece and a processing tool

In an arrangement for measuring the distance between a metallic workpiece and a processing tool moved toward and away from the workpiece, especially for adjusting the distance of acetylene, plasma and laser cutting machines whereby at least one sensing device facing the surface of the workpiece to be processed is provided to the tool;

• wherein the electrical properties of the sensing device can be affected by selectively reducing and increasing the distance to the workpiece and whereby the sensing device is connected to an electrical circuit to evaluate the changes of the electrical properties of the sensing device, the improvement being a compensation sensing arrangement in addition to the sensing device, the compensation sensing arrangement being arranged laterally on the tool to be affected by elevations of the workpiece disposed parallel to the direction of movement of the tool, each of the sensing device and the compensation sensing arrangement having a reactance which can be affected by the workpiece to comprise a pair of reactances, one of the reactances being inductive and the other being capacitive, and the reactances are dimensioned and electrically connected in opposition in such a way that by a predetermined lateral approach of the workpiece to the electrodes the tool can be compensated by changes of the respective inductive and capacitive reactances which are numerically about equal but are electrically oppositely directed.