Method of shipping and using semiconductor liquid source materials
AssigneeJ. C. Schumacher Co.
InventorsJohn C. Schumacher, Andre Lagendijk
Life of this patent
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AssigneeJ. C. Schumacher Co.
InventorsJohn C. Schumacher, Andre Lagendijk
Estimating the term…
The gas inlet tube and the outlet tube in the upper end of a "bubbler" container are each sealed with an easily breakable wall adjacent the wall where the tubes join the container. A second seal is formed on the outer ends of the tubes creating a compartment in which may be positioned a small hammer. The outer seals are sufficient to meet safety regulations regarding the shipment of highly corrosive or poisonous materials. The user of the material, breaks the outer seals, positions the hammer if not already in place, makes the desired connections to the tubes, applies a purging gas to the upper ends of the tubes, and breaks the inner seals by magnetically or otherwise actuating the hammer resting on the inner seal, thereby connecting the material to the desired system without exposing the material to the atmosphere.
A method of packaging liquid for shipment which permits said liquid after receipt by a user, to be used in a manner which avoids exposure of said liquid to the atmosphere comprising:
A method of packaging for shipment and use ultra-high purity liquids used in the manufacture of semiconductor devices in a manner to minimize the possibility of contamination of the liquid including the avoidance of exposure to the atmosphere, said method comprising:
A method of acquiring and using high-purity liquids employed in connection with the manufacture of semiconductor devices comprising the steps of:
A method of packaging and using ultra-high purity liquids used in the manufacturing of semiconductor devices such as boron tribromide, phosphorous oxychloride, phosphorous tribromide, silicon tetrabromide, arsenic trichloride, arsenic tribromide, antimony petachloride and combinations thereof, in a manner to minimize the possibility of contamination of the liquid including the avoidance of exposure to the atmosphere, said method comprising:
A method of packaging and using ultra-high purity liquids used in the manufacturing of semi-conductor devices such as boron tribromide, phosphorous oxychloride, phosphorous tribromide, silicon tetrabromide, arsenic trichloride, arsenic tribromide, antimony pentachloride and combinations thereof, in a manner to minimize the possibility of contamination of the liquid including the avoidance of exposure to the atmosphere, said method comprising:
A method of handling and utilizing an untra-high purity liquid used in the manufacturing of semiconductor devices such as boron tribromide, phosphorous oxychloride, phosphorous tribromide, silicon tetrabromide, arsenic trichloride, arsenic tribromide, antimony pentachloride and combinations thereof, in a manner to minimize the possibility of contamination of the liquid including the avoidance of exposure to the atmosphere, said method comprising:
Dependencies are inferred from the claim text.