Solderless filter mounting for header assemblies
AssigneeAMP Incorporated
InventorsEric E. Vanderheyden, Albert Casciotti
Life of this patent
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AssigneeAMP Incorporated
InventorsEric E. Vanderheyden, Albert Casciotti
Estimating the term…
An improved solderless filter mounting for header assemblies or feedthrough connectors is described for retrofitting filtered terminals into an existing electronic circuit. Each of a plurality of terminals is provided with a filter sleeve which is soldered thereto. The filtered terminal assemblies are inserted into a header housing in a fixed array with the filters being electrically connected to a ground plane by means of a conductive rubber gasket. Rubber mounting blocks are positioned on the filters and pins to each side of the ground plane and the conductive rubber gasket and are placed under compression by housing members to cause an electrical interconnection between the filters and the ground plane through the gasket while absorbing any shock that may be imparted to the filters from the pins. The housing members are identical and are provided with polarizing means, latching means, and the like, as necessary.
A filtered header or feedthrough connector comprising:
A filtered header or feedthrough connector for retrofitting existing electronic circuitry to provide RFI/EMI filtering, comprising:
In a filtered header or feedthrough connector means to provide solderless mounting of RFI/EMI filtering, comprising:
A filtered connector comprising:
A solderless method for mounting filtered terminals in a connector comprising the steps of:
Dependencies are inferred from the claim text.