Surface acoustic wave device and method of manufacturing
AssigneeMurata Manufacturing Co., Ltd.
InventorMichio Kadota
Life of this patent
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Abstract
A transducer region and lead-out electrodes connected to the transducer region are formed on one main surface of a surface acoustic wave substrate and a sheet having a thickness directionally conductive property and a plane directionally insulating property is layered on the one main surface of the substrate through a spacer. The spacer achieves a function for forming a necessary gap in the transducer region between the sheet and the substrate and a function for adhering the sheet onto the substrate. The lead-out terminals are connected through the sheet to the lead-out electrodes by virtue of the thickness directional conductivity of the sheet.
Claims18
A surface acoustic wave device, comprising:
- a substrate having a main surface, transducer means located on said main surface and connected to withdrawing means which is also located on said main surface, said withdrawing means for connecting said transducer means to an external circuit;
- a sheet member mounted on said main surface of said substrate and having an electrically conductive property in a direction perpendicular to said main surface and an insulating property a direction parallel to said main surface;
- an interposing member interposed between said substrate and sheet member but not interposed between a portion of said withdrawing means and said sheet member, for forming a predetermined gap between said sheet member and said transducer means;
- and
- a lead-out terminal electrically connected to said sheet member at a location which causes said lead-out terminal to be electrically connected to said withdrawing means through said sheet member by virtue of said directionally conductive property of said sheet member.
A surface acoustic wave device in accordance with any one of the preceding claims, wherein said interposing member comprises an adhesive agent serving to adhere said sheet member to said substrate.
A method for manufacturing a surface acoustic wave device, including a substrate having a transducer region and a withdrawing portion formed on one main surface of said substrate said withdrawing portion for connection of said transducer region to an external circuit, a sheet member mounted on said one main surface of said substrate and having an electrically conductive property in a direction perpendicular to said main surface and an insulating property in a direction parallel to said main surface, an interposing member for forming a predetermined gap between said sheet member and said transducer region and interposed between said substrate and said sheet member, but not interposed between said sheet member and a portion of said withdrawing portion, and a lead-out terminal for connection to said withdrawing portion through said sheet member, said method comprising the steps of:
- preparing a composite including said substrate, said interposing member and said sheet member, and
- electrically connecting and mechanically fixing said lead-out terminal to the surface of said sheet member at a position corresponding to said withdrawing portion.
Dependencies are inferred from the claim text.