Closure for sealing openings in panels

A one piece plastic sealing plug device adapted to close and seal a complimentary aperture formed in panels, said plug being of the dished type having a bottom portion, a lateral encircling wall, external engagement means on said wall, a resilient head to be applied against the forward surface of the panel adjacent the edge of the aperture and ringlike thermofusible means disposed between the panel and said resilient head, said sealing plug device being characterized in that it includes resilient head means having a peripheral channel, said thermofusible means including a peripheral bead portion adapted to be captured within said resiliently urged channel and to be melted between said channel and panel upon application of an elevated temperature, whereby it is substantially retained under said head and caused to flow in its melted condition within the space that may occur between said sealing plug device and the aperture it is fitted in, whereby after colling such device becomes perfectly integral with said panel in said hole due to solidification of the thermofusible meas to the exact required shape without any loss of material regardless of the planarity and angular position in space said panel may assume.