Improved solder interconnection between a semiconductor device and a supporting substrate
AssigneeInternational Business Machines Corporation
InventorsCharles Carpenter, Joseph F. Fugardi, Lawrence V. Gregor, Peter S. Grosewald, Morton D. Reeber
Life of this patent
Estimating the term…
Abstract
A ball limiting metallurgy pad structure for a semiconductor device solder bond interconnection comprising: a conductive layer that is adherent to the semiconductor device passivating layer, a relatively thick layer of a material having a high thermal conductivity, a barrier layer that protects the high conductivity layer by physically preventing any interaction or alloying with the subsequent layers, and a layer of a material that is solder wettable.
Claims3
An improved ball limiting metallurgy pad structure for a solder interconnection for a semiconductor device comprising,
- a first layer of chromium,
- a phased layer of chromium-copper,
- a first layer of copper,
- a phased layer of chromium-copper,
- a second layer of copper,
- a surface layer of gold.
The ball limiting metallurgy pad structure for a semiconductor device solder bond interconnection that is made from electrically conductive materials consisting of:
- an adherent layer formed of chromium that will bond to the passivating layer of a semiconductor device
- a relatively thick layer of high thermal conductivity metal bonded to said chromium layer
- a barrier layer formed of a metal that protects said high conductivity metal layer by physically preventing any interaction or alloying with overlying layers
- a layer that is formed of a solder wettable metal
- a surface protective layer
- said layer of high thermal conductivity metal, when said pad structure is joined to a substrate with a solder connection, capable of reducing the radial thermal gradient within said interconnection,
- said barrier layer preventing dissolution and interaction of said layer of high thermal conductivity metal with the molten solder during the joining operation.
Dependencies are inferred from the claim text.