Method of making a multi-layer ceramic substrate
AssigneeInternational Business Machines Corporation
InventorsCharles M. McIntosh, Arnold F. Schmeckenbecher
Life of this patent
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Abstract
A method of making a multi-layer ceramic substrate for an integrated circuit device package having internal circuitry by forming a plurality of porous ceramic bisque sheets, impregnating the pores of the bisque sheets with an organic binder material, forming openings through the impregnated bisque sheets, filling the openings with conductive material and imprinting conductive circuitry patterns on the surface of the impregnated bisque sheets of a conductive material, assembling the plurality of apertured printed impregnated bisque sheets into a laminated unit, and sintering the laminated unit to form a unitary laminated structure having an interconnected internal circuitry system.
Claims21
A method of making a multi-layer ceramic substrate for an integrated circuit device package having internal circuitry comprising:
- forming a plurality of porous ceramic bisque sheets by shaping a mixture which includes (1) a powdered ceramic material;
- (2) a lower melting powdered glass material;
- and (3) an organic binder material, and subsequently heating the resultant shaped sheet at a temperature less than the sintering temperature of the ceramic material but at least as high as the softening temperature of the glass material, said heating operative to adhere the particles of ceramic material with the glass material and burn off the binder material,
- impregnating the pores of said bisque sheets with an organic binder material,
- forming openings through said impregnated bisque sheets,
- filling said openings with conductive material,
- imprinting conductive circuitry patterns on the surface of said impregnated bisque sheets of a conductive material,
- assembling said plurality of apertured printed, impregnated bisque sheets into a laminated unit,
- sintering said laminated unit to form a unitary laminated structure having an interconnected internal circuitry system.
Dependencies are inferred from the claim text.