Process for heating thin surface layers
AssigneeE. I. Du Pont de Nemours and Company
InventorsC. Bradford Jones, Richard D. Kinard
Life of this patent
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Abstract
In the lamination of thermoplastic polymer layers to substrates a thin surface layer of the substrate can be heated to improve adhesion without substantially heating the mass of the substrate by advancing the exposed surface of the thin layer in surface-conforming contact with a heated surface for 0.1 to one second at an interface pressure of 0.1 to 5 kilograms per centimeter of substrate width, the heated surface having an initial temperature of 35.degree.-350.degree. C.
Claims14
A process for heating a thin surface layer of a thicker dielectric substrate without substantially heating the substrate mass which comprises advancing the exposed surface of the thin layer in surface-conforming contact with a continuously heated surface for 0.1 to one second at an interface pressure of 0.1 to 5 kilograms per centimeter of substrate width, the heated surface having an initial temperature of 35.degree.-350.degree. C.
Dependencies are inferred from the claim text.