Solid state device mounting and heat dissipating assembly
AssigneeGould Inc.
InventorsJay M. Prager, Joseph F. Sadlow, John K. Nitzsche
Life of this patent
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AssigneeGould Inc.
InventorsJay M. Prager, Joseph F. Sadlow, John K. Nitzsche
Estimating the term…
By providing a retaining surface, upon which a solid state device is positioned, and a device securing means movable into and out of compression engagement with a portion of the solid state device, for securely mounting and retaining the device in sandwiched interengagement between the securing means and the retaining surface, a unique solid state device mounting assembly is achieved which eliminates fastening means extending through the solid state device for secure mounting thereof. In addition, the assembly incorporates heat dissipating means cooperatingly associated with the retaining surface for absorbing and dissipating heat generated by the solid state device. In the preferred embodiment, an elongated unitary one-piece bracket member is employed for securely mounting a plurality of solid state devices in the single bracket member, with the bracket member being mountable to a heat dissipating surface.
A heat dissipating and solid state device mounting assembly adapted for securely holding heat generating solid state devices and for absorbing and dissipating said heat, the assembly comprising
A heat dissipating and solid state device mounting system securely holding and maintaining a plurality of heat generating solid state devices, each having a metal mounting tab extending therefrom, and for absorbing and dissipating the heat generated from said solid state devices, the assembly comprising
Dependencies are inferred from the claim text.