Circuit structures including integrated circuits
AssigneeInternational Computers Limited
InventorGerald H. Hantusch
Life of this patent
Estimating the term…
Abstract
The specification discloses a structure for locating integrated circuits on a substrate by etching V grooves in a silicon substrate arranged to co-operate with spheroidal connectors on the integrated circuit. Contact pads are located in the V grooves whereby connections are made to the integrated circuit through the spheroidal connectors.
Claims9
A method of manufacturing a circuit structure including integrated circuit comprising the steps of providing a planar member of semi-conductor material;
- forming on one surface of said member a plurality of recesses of V-section;
- forming on said one surface a plurality of electrical conductors including contact areas arranged in a predetermined pattern, each contact area having at least a portion thereof lying in one of said recesses;
- providing an integrated circuit chip of semi-conductor material, the chip carrying on one surface a plurality of raised electrically conductive contact pads arranged in a formation corresponding to said predetermined pattern;
- aligning the contact pads on the chip one with each corresponding contact area on the planar member by locating each contact pad in the recess of the corresponding contact area;
- and bonding each contact pad to the corresponding contact area to provide electrical contact therebetween.
A circuit structure comprising a planar member of semi-conductor material having on one surface thereof a plurality of recesses of V-section and a plurality of conductors including contact areas arranged in a predetermined pattern, each contact area having at least a portion thereof lying in one of said recesses;
- and an integrated circuit chip of semi-conductor material carrying on one surface a plurality of raised electrically conductive contact pads arranged in a formation corresponding to said predetermined pattern, each contact pad being respectively bonded in electrical contact into the recess of the corresponding contact area on the substrate.
A method of manufacturing a substrate for mounting an integrated circuit element having raised contact pads arranged in a predetermined pattern comprising the steps of providing a planar member of semi-conductor material;
- forming on one surface of said member a plurality of recesses of V-section serving to co-operate with the raised contact pads and thereby locate said element on the substrate;
- and forming on said one surface a plurality of metallic electrical contact areas arranged in said predetermined pattern, at least a portion of each contact area lying in a corresponding one of the recesses.
Dependencies are inferred from the claim text.