Epoxy imide compositions
AssigneeE. I. Du Pont de Nemours and Company
InventorWilliam F. Graham
Life of this patent
Estimating the term…
Abstract
A composition useful for making circuit boards which is the reaction product of (a) an epoxy resin or an epoxy novolac resin and optionally, a brominated epoxy resin and (b) a bismaleimide; wherein the product of (a) and (b) is subsequently reacting with a curing agent such as a diamine of the formula H.sub.2 N--R.sup.1 --NH.sub.2 where R.sup.1 is an aromatic, aliphatic or cycloaliphatic group. The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used to form a circuit boards that have good electrical and physical properties.
Claims11
A composition comprising 20-80% by weight of a reaction product and 20-80% of a nonamide solvent for the reaction product having a dispersion solubility parameter of 7.2-10.5, a polar solubility parameter of 3-9.5 and a hydrogen bonding solubility parameter of 0-5.5;
- wherein the reaction product consists essentially of
- (a) an epoxy resin of the formula ##STR14## wherein R is an alkylene group of 1-4 carbon atoms, n is a positive integer;
- and the resin having an epoxide equivalent of about 150-1000;
- and
- (b) a bismaleimide of the formula ##STR15## where R.sup.1 is an aromatic, aliphatic or cycloaliphatic group and wherein (a) and (b) are reacted at 115.degree.-135.degree. C. for about 0.5-2 hours and subsequently contacting the product of (a) and (b) with
- (c) a diamine of the formula ##STR16## wherein the molar ratio of bismaleimide to diamine is about 0.6 to 0.8.
A composition comprising 20-80% by weight of a reaction product and 20-80% of a nonamide solvent for the reaction product having a dispersion solubility parameter of 7.2-10, a polar solubility parameter 3-9.5 and a hydrogen bonding solubility parameter of 0-5.5;
- wherein the reaction product consists essentially of
- (a) an epoxy novolac resin of the formula ##STR20## where n is a positive integer and the resin has an epoxide equivalent of about 150-300
- (b) a bismaleimide of the formula ##STR21## where R.sup.1 is an aromatic, aliphatic or cycloaliphatic group and wherein (a) and (b) are reacted at about 115.degree.-135.degree. C. for about 0.5-2 hours and subsequently reacting the product of (a) and (b) with
- (c) a diamine of the formula ##STR22## wherein the molar ratio of bismaleimide to diamine is about 0.6 to 0.8.
Dependencies are inferred from the claim text.