Catalytic filler for electroless metallization of hole walls
AssigneePhotocircuits Division of Kollmorgen Corporation
InventorEdward J. Leech
Life of this patent
Estimating the term…
Abstract
Improved catalytic fillers result from the use of hydrazine to render reducible metal salts absorbed on filler material surfaces catalytic to the deposition of electroless metal. Use of such catalytic fillers in forming insulated articles in which holes are made lead to improved electroless metallization of the barrels of such holes.
Claims33
In a process for making a filler material that is catalytic to the deposition of electroless metal, the improvement which comprises the steps:
- a. adsorbing a reducible metal compound from a liquid medium comprising said compound on to the surface of a filler material;
- b. rendering said adsorbed compound catalytic to the deposition of electroless metal by contacting said adsorbed compound with hydrazine;
- and
- c. incorporating the catalytic filler so formed into the formation of an insulating article.
A process for making an insulated article that is catalytic throughout to the deposition of electroless metal, comprising the steps:
- (a). adsorbing palladium chloride from a liquid medium on to the surface of finely divided clay;
- (b). catalyzing said adsorbed palladium chloride to the deposition of electroless metal by contacting with an aqueous solution comprising hydrazine;
- (c). drying the resultant catalytic filler;
- (d). mixing said catalytic filler with a resinous material;
- and
- (e). forming a catalytic insulated article incorporating the resultant catalytic resinous material.
An improved process for electrolessly metallizing holes formed in insulated articles, said process comprising the steps:
- (a). adsorbing at least one compound of at least one metal selected from the group consisting of palladium and silver from a liquid medium containing said compound on to the surface of a finely divided filler material;
- (b). rendering the compound so adsorbed catalytic to the deposition of electroless metal by contacting said adsorbed compound with an aqueous solution comprising hydrazine;
- (c). incorporating the catalytic filler so formed into the formation of an insulated article;
- (d). forming at least one hole in the catalytic insulated article so formed;
- and
- (e). contacting the barrel of said hole with an electroless metal deposition solution.
A process for electrolessly metallizing holes formed in insulated articles, comprising the steps:
- a. adsorbing palladium chloride from a liquid medium on to the surface of finely divided clay;
- b. catalyzing said adsorbed palladium chloride to the deposition of electroless metal by contacting with an aqueous solution comprising hydrazine;
- c. drying the resultant catalytic filler;
- d. mixing said catalytic filler with a resinous material;
- e. forming a catalytic insulated article incorporating the resultant catalytic resinous material;
- f. forming at least one hole in said catalytic insulated article;
- and
- g. metallizing the barrel of said hole by contacting with an electroless metal deposition bath.
A process for making an electrically insulating article that is catalytic throughout to the deposition of electroless copper from an electroless metal plating bath comprising a copper compound, a reducing agent and a complexing agent, said process comprising the steps:
- a. adsorbing a compound of a noble metal from a liquid medium comprising said compound on to the surface of a finely divided filler material;
- b. rendering the adsorbed compound catalytic to the deposition of electroless copper by contacting said adsorbed compound with an aqueous solution comprising hydrazine;
- and
- c. incorporating the catalytic filler so formed into the formation of an insulating article.
An improved process for electroless depositing copper on the surface of holes formed in insulated article, said process comprising the steps:
- a. adsorbing at least one compound of at least one metal selected from the group consisting of palladium and silver from a liquid medium containing said compound on to the surface of a finely divided filler material;
- b. rendering the compound so adsorbed catalytic to the deposition of electroless copper by contacting said adsorbed compound with an aqueous solution comprising hydrazine;
- c. incorporating the catalytic filler so formed into the formation of an insulated article;
- d. forming at least one hole in the catalytic insulated article so formed;
- and
- e. contacting the barrel of said hole with an electroless metal deposition solution comprising a copper compound, a reducing agent and a complexing agent.
Dependencies are inferred from the claim text.