Plating process
AssigneeSonix, Inc.
InventorKouichi Shimamura
Life of this patent
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Abstract
This invention relates to a plating process and its means, wherein an accurate plating for a smaller work surface is carried out high-speedily. For this purpose, the smaller work surface is enclosed by a mask of the plating means, and a plating solution is jetted for the work surface from a nozzle disposed within a closed space of the mask inside. Further, the plating process according to this invention has a step for suctioning and discharging speedily an extra plating solution together with atmosphere within the closed space as well as outer air induced by an outer air induction means. Further, the used plating solution is again returned to a plating solution tank by a preferred recycling system. Thus, the consumption of the plating solution is saved greatly.
Claims11
A process of continuously electroplating of an elongated electroconductive sheet, comprising the steps of enclosing a smaller work surface of the sheet with a mask thereby defining a closed space within said mask and to determine a plating shape and pattern to be produced;
- introducing an outer air by air induction means having no influence upon the surface of the sheet to be treated to obtain an air curtain within said mask;
- disposing a nozzle within said closed space;
- jetting a plating solution through said nozzle to said work surface while supplying electric power to different polarity to said nozzle and said work surface and simultaneously suctioning to and discharging fluid from said closed space;
- plating the jetted plating solution on said work surface;
- and discharging said plating solution together with atmosphere from in said closed space by suctioning said solution from said mask, whereby said air-introducing step speeds up said discharging step and prevents said plating solution from permeating outside said mask.
Dependencies are inferred from the claim text.