Large scale integrated circuit production
AssigneeInternational Computers Limited
InventorGerald H. Hantusch
Life of this patent
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Abstract
A method of forming connection networks for an integrated circuit device, by forming an orthogonal array of grooves in a substrate, with the grooves of one array deeper than those of the other array; and by providing conductive strips at the bottoms of the grooves and at selected regions of the groove side walls which strips serve to provide a desired pattern of interconnections.
Claims10
A method of forming a connection network for an integrated circuit device, including the steps of providing a substrate of crystalline material having a planar surface, forming in the substrate a first array of grooves of a first depth relative to the planar surface, forming in the substrate a second array of grooves of a second depth relative to the planar surface and such that the grooves of the arrays intersect, and providing conductive strips in the grooves of each said array together with additional conductive strips for selectively electrically interconnecting said conductive strips so that the latter are interconnected according to a desired pattern of interconnections.
Dependencies are inferred from the claim text.