Photoconductive structures
AssigneeU.S. Philips Corporation
InventorAndrew A. Turnbull
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Abstract
A photoconductive structure comprises an electrically insulating substrate bearing an evaporated metal electrode pattern, and a 60 to 150 nm thick polyimide film disposed between a sintered cadmium selenide layer and the substrate with the superposed electrode pattern. In the absence of the polyimide film, there had been unacceptable attack of the electrode structure and of silica substrates by the cadmium selenide.
Claims2
A photoconductive structure comprising an electrically insulating substrate, an evaporated metal electrode pattern on said substrate, a 60 to 150 nm thick polyimide film overlying said substrate and said electrode pattern, and a sintered cadmium selenide layer on said polyimide film.
Dependencies are inferred from the claim text.