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US 4,285,781 AGranted
Metal support for an electronic component interconnection network and process for manufacturing this support
OwnerJean Le Rouzic, Loic Demeure +1inventors
InventorsJean Le Rouzic, Loic Demeure, Yvon Le Roux
Life of this patent
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Abstract
In a support for an electronic component interconnection network, a metal substrate coated with a layer of aluminium of granular structure, whose thickness may vary between a few microns and a few tens of microns, this layer being anodized.
Claims8
In a support for an electronic component interconnection network, a metal substrate coated with a layer of aluminium of granular structure, whose thickness may vary between a few microns and a few tens of microns, this layer being anodized.
Dependencies are inferred from the claim text.