Apparatus for soldering printed circuit boards

An apparatus for soldering a printed circuit board, comprising:

• a carrier adapted to support a printed circuit board thereon;
• first front and rear wheel members mounted at one side of said carrier;
• second front and rear wheel members mounted at the other side of said carrier;
• a pair of laterally spaced first and second track members adapted for supporting said carrier thereon, said first track member being engageable with said first front and rear wheel members of said carrier and said second track member being engageable with said second front and rear wheel members;
• a solder vessel containing molten solder and located between said first and second track members;
• drive means for displacing said carrier along said first and second track members and supportingly engageable with a part of said carrier on said one side thereof;
• said first and second track members each having first and second depressions of the same depth formed at positions to be met simultaneously by said first and second front and rear wheel members of said carrier;
• said first and second depressions having a length and a depth sufficient to allow the underside of said printed circuit board on said carrier to be brought into contact with the molten solder in said solder vessel when said first and second front and rear wheel members are moving along said first and second depressions;
• a first rail means slidably located parallel with said first track member and having a guide track portion supportingly engageable with said first front and rear wheel members;
• and
• means for driving said first rail means such that said first front and rear wheel members are guidingly engaged by said guide track portion when said first front wheel member and said second rear wheel member are passing respectively through said second and first depressions and that said first front and rear wheel members are engageable with at least part of said first and second depressions to contact said printed circuit board on said carrier with the molten solder in said solder vessel.