Structure of fluid condensing and heat conducting surface of condenser
AssigneeHisaka Works, Ltd.
InventorsKenzo Masutani, Akira Horiguchi, Hiroyuki Sumitomo
Life of this patent
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Abstract
A structure of fluid condensing and heat conducting surface of the condenser characterized in that completely recessed grooves for collecting fluid are provided on said surface integrally therewith, wherein the distance between the centers of radii of rounded corners of said groove is made less than 3 mm.
Claims1
A structure of a fluid condensing and heat conducting surface of a condenser plate characterized in that completely recessed grooves for collecting fluid are provided on said surface integrally therewith, said grooves each having two rounded corners of a predetermined radius with the centers of said radii being spaced from each other, and positioned on the same side of said plate, wherein the distance between the centers of radii of rounded corners of said groove is made less than 3 mm.
Dependencies are inferred from the claim text.