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US 4,285,003 AGranted
Lower cost semiconductor package with good thermal properties
AssigneeMotorola, Inc.
InventorStanley Gaicki
Life of this patent
Estimating the term…
Abstract
An improved mounting base is disclosed in which a semiconductor die is mounted on a thin pedestal within a large counter bore in the mounting base or header of the transistor package.
Claims8
In a case for semiconductor devices having a mounting base having at least one aperture through which a lead passes, a pedestal to which semiconductor die are attached, and a cap for enclosing said die, the improvement comprising:
- a thinned region in said base for reducing the thickness of said base in a central area wherein said thinned region is greater than 5 mils (0.13 mm) thickness, said pedestal being 15-60 mils (0.38-1.5 mm) thick and smaller in area than said thinned region and being attached to said base in said central area.
Dependencies are inferred from the claim text.