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US 4,284,541 AGranted
Hot-melt pressure sensitive adhesive compound
AssigneeMitsui Petrochemical Industries, Ltd.
InventorsMasami Takeda, Riichiro Nagano
Life of this patent
Estimating the term…
Abstract
A hot-melt compound comprising 30 to 70% by weight of a modified ethylene..alpha.-olefin copolymer rubber having a melt index of at most 500 and prepared by grafting an unsaturated carboxylic acid or derivative thereof to an ethylene..alpha.-olefin copolymer rubber or a partial ester of said modified copolymer rubber and 70 to 30% by weight of a tackifier.
Claims22
A hot-melt pressure sensitive adhesive compound consisting essentially of:
- (a) 30 to 70% by weight of a modified ethylene..alpha.-olefin copolymer rubber containing from 40 to 85 mol % of ethylene units, having a melt index of 5 to 500 and prepared by grafting an unsaturated carboxylic acid or derivative thereof to an ethylene..alpha.-olefin copolymer rubber or a partial ester of said modified copolymer rubber, and
- (b) 70 to 30% by weight of a tackifier selected from the group consisting of aliphatic, aromatic alicyclic and copolymer type petroleum resins, terpene resin, rosin and cumarone-indene resin.
A hot-melt pressure-sensitive adhesive compound consisting essentially of:
- (a) 30 to 70% by weight of a modified ethylenepropylene copolymer rubber containing from 60 to 83 mol % of ethylene units, having a melt index of 10 to 200 and prepared by grafting from 1 to 5% by weight of maleic acid, maleic anhydride, acrylic acid, methacrylic acid or methyl methacrylate onto said ethylene-propylene rubber;
- and
- (b) from 70 to 30% by weight of a petroleum resin or terpene resin tackifier.
Dependencies are inferred from the claim text.