Multi-module dip transfer and insertion machine
AssigneeUniversal Instruments Corporation
InventorsStanley Janisiewicz, Robert H. Holmes
Life of this patent
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Abstract
An apparatus is provided for individually selecting a number of dual in-line (DIP) components and sequentially inserting them into a printed circuit board. The apparatus has a basic mode of operation, under a program control, and comprises a shuttle assembly and a component insertion assembly. In operation, the shuttle assembly transfers a component from a selected one of a plurality of magazines to an unload station. At the unload station, the shuttle assembly loads the insertion assembly which rotates to a vertical position for insertion of the component in a printed circuit board. The printed circuit board is mounted on an X-Y positioning system controlled by a tape reader or a computer which also determines the automatic sequencing of the shuttle assembly.
Claims27
An apparatus for inserting electronic components, said components having a body and dual in-line parallel leads extending therefrom, said apparatus comprising:
- a magazine for supplying said components one at a time at a first station;
- an insert head means for receiving an individual component at a second station, rotating to an insert position, and inserting said component into a printed circuit board;
- and
- a shuttle means for engaging said magazine, and releasing and removing an individual component from said magazine assembly at said first station, transporting said component to said second station, loading said insert head means with said component, and returning to said magazine assembly.
Dependencies are inferred from the claim text.