Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface

An apparatus for providing active cooling for semiconductor wafers during implantation in an ion implantation chamber, comprising

• a housing incorporating a convexly curved platen, said platen having a coating of a pliable thermally conductive material adhered to the surface thereof;
• a clamping ring mounted within said housing in slidable relationship with said convexly curved platen, the travel of said clamping ring ranging between a receiving or eject position wherein said clamping ring and said convexly curved platen define a slot for receiving or rejecting a semiconductor wafer and a locked position wherein a semiconductor wafer is firmly pressed against said convexly platen by the contact of said clamping ring against said semiconductor wafer at its circumferential edge, said wafer substantially conforming on its back side to the contour of said convexly curved platen;
• actuating means for determining the position of said clamping ring with respect to said convexly curved platen;
• and
• active cooling means for transferring thermal energy from said platen.