Method of assembling an encapsulated chip capacitor
AssigneeSprague Electric Company
InventorsDavid G. Thompson, John T. Ogilvie
Life of this patent
Estimating the term…
Abstract
An encapsulated chip capacitor is made by inserting capacitor bodies between two channels of L-shaped cross-section, electrically connecting the capacitor cathodes to one channel and the anodes to the other thus providing terminals, filling the resulting assembly with insulating encapsulant, curing it, and separating the cured assembly into individual chip capacitors.
Claims8
A method for assembling and encapsulating chip capacitors comprising providing two metal channels of substantially L-shaped cross-section, each having a vertical plate portion and a horizontal plate portion forming a right angle along a common edge, said channels facing each other to serve as electrodes, then placing capacitor bodies in side-by-side relationship and spaced from each other in and between said channels, electrically connecting the cathode of each body to one of said channels, electrically connecting the cathode of each body to one of said channels, electrically connecting the anode of each body to the other of said channels, then filling the channel assembly with a curable insulating material to encapsulate said bodies, curing said material, and then separating the encapsulated capacitors from each other into individual units.
Dependencies are inferred from the claim text.