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US 4,270,990 AGranted
Acidic electroplating baths with novel surfactants
AssigneeMinnesota Mining and Manufacturing Company
InventorJaan J. Fong
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Abstract
An acidic electroplating bath containing, as a surfactant, a compound of the formula: R--Ar--O--(C.sub.3 H.sub.6 O).sub.n --(C.sub.2 H.sub.4 O).sub.m --H wherein R is at least one halide, aldehyde, amine, carboxyl, ketone or mixture thereof, Ar is benzene or naphthalene, n is from zero to 10, m is from zero to 100, and m+n is greater than zero.
Claims2
An acidic electroplating bath comprising metal ions, an electrolyte, and at least one compound of the formula:
- R--Ar--O--(C.sub.3 H.sub.6 O).sub.n --(C.sub.2 H.sub.4 O).sub.m --H
- wherein Ar is benzene or naphthalene;
- R is selected from the group consisting of at least one halide, amine, carboxyl, ketone and mixtures thereof;
- n is from zero to 10, m is from zero to 100, and m+n is greater than zero.
1 more element
Dependencies are inferred from the claim text.