Forced vaporization heat sink for semiconductor devices
AssigneeElectric Power Research Institute, Inc.
InventorsGerald M. Lazarek, Fred W. Staub
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Abstract
A fluid cooled heat sink is provided for use in cooling high power semiconductor devices. The heat sink includes a body formed of thermally conductive material having internal fluid passageways. Cooling fluid from an external source is passed through the heat sink. The preferred heat sink includes a pair of manifolds and means cooperating with the manifolds to allow selective interconnection of the interior passageways of the heat sink.
Claims15
A fluid cooled heat sink for use in cooling high power semiconductor devices, comprising:
- a unitary body formed of thermally conductive material, a plurality of fluid passageways in said body, manifold means communicating with said passageways, and mechanically movable means cooperating with said manifold means for selectively interconnecting said passageways to provide various fluid-flow configurations through said body.
A fluid cooled heat sink for use in cooling high power semiconductor devices, comprising:
- a unitary body formed of thermally conductive material, said body having first and second opposed sides, first and second sides, respectively, each said first and second manifold means including a manifold passage extending generally parallel to the adjacent side of said body, a plurality of fluid passageways in said body extending between and opening into said manifold passages, a plurality of movable plugs spaced along each said manifold passage between said fluid passageways, each said movable plug being movable into the manifold passage to block the manifold passage to prevent fluid communication between selected fluid passageways whereby various fluid-flow configurations through said body are provided.
Dependencies are inferred from the claim text.