Method of manufacturing solid-state devices in which planar dimensional distortion is reduced

A method of manufacturing a microminiature solid-state device, which comprises:

• providing a radiation-sensitive material on a first major surface of a solid-state substrate;
• providing a first mask having a first pattern for defining locations on said radiation-sensitive material;
• exposing said radiation-sensitive material to radiation through said mask pattern in a first exposure step to define locations for localized processing at said substrate surface while maintaining said mask and said substrate in a substantially planar condition;
• then locally processing said substrate to fabricate the device in a process which causes dimensional distortion of siad substrate surface in the plane of the substrate surface;
• providing further radiation-sensitive material on said major surface;
• adjusting the relative sizes of the area of said substrate surface and the area of said second mask in a substantially uniform manner;
• and
• then exposing said further radiation-sensitive material to radiation in a second exposure step through a second mask pattern in a second mask to define further locations for localized processing at said substrate surface, said relative size adjustment being in such a direction as to reduce the misalignment in the relative locations defined by said first and second exposure steps resulting from said planar dimensional distortion.