Sealing glass
AssigneeHitachi, Ltd.
InventorsHiromitsu Kawamura, Akira Misumi, Kozo Odawara
Life of this patent
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Abstract
A non-conductive sealing glass consists of 100 parts by weight of a composition containing 20-30 mole % of B.sub.2 O.sub.3, 60-69 mole % of PbO, 0-10 mole % of ZnO, O-6 mole % of CuO and 0.5-2.0 mole % of Bi.sub.2 O.sub.3 ; and 1-5 parts by weight of either one or both of SiO.sub.2 and Al.sub.2 O.sub.3. The sealing glass is suitable for bonding together and sealing soda-lime-silica glass plates utilized to manufacture panel display devices.
Claims2
Non-conductive sealing glass of not greater than about 10.mu. average grain diameter consisting of 100 parts by weight of a composition consisting of 20-30 mole % of B.sub.2 O.sub.3, 60-69 mole % of PbO, 0-10 mole % of ZnO, 0-6 mole % of CuO and 0.5-2.0 mole % of Bi.sub.2 O.sub.3 ;
- and 1-5 parts by weight of either one of SiO.sub.2 and Al.sub.2 O.sub.3.
Non-conductive sealing glass of not greater than about 10.mu. average grain diameter consisting of 100 parts of weight of a composition consisting of 20-30 mole % of B.sub.2 O.sub.3, 60-69 mole % of PbO, 0-10 mole % of ZnO, 0-6 mole % of CuO and 0.5-2.0 mole % of Bi.sub.2 O.sub.3 ;
- and 1-5 parts by weight of the sum of SiO.sub.2 and Al.sub.2 O.sub.3.
Dependencies are inferred from the claim text.