Method of manufacturing a target assembly for a camera tube
AssigneeU.S. Philips Corporation
InventorArthur M. E. Hoeberechts
Life of this patent
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Abstract
A target and target assembly for a camera tube in which a semiconductor plate is provided on an annular support. The plate has a semiconductor monocrystalline edge portion which comprises an integrated circuit for processing the electrical signals originating from the target. The central portion of the plate is provided with a radiation-sensitive layer having one or more radiation-permeable electrodes. The integrated circuit is provided with inputs which are connected to the electrodes and with leads for the supply and control voltages. A window is provided on the electrodes and overlaps the inner edge of the support, the window, the edge portion and the support adjoining each other in a vacuum-tight manner.
Claims8
A method of making a target assembly for converting incident radiation into electrical signals for use in a camera tube or the like comprising the steps of:
- forming an integrated circuit for processing electrical signals in a peripheral portion of a semiconductor plate;
- and
- providing at least one electrode which is permeable to said radiation and which is connected to an input of said integrated circuit on a central portion of one side of said plate;
- and then, in the following order:
- securing a window permeable to said radiation to said one side of the plate over said electrode;
- forming an opening in a central portion of the other side of said plate to expose a portion of the surface of said electrode remote from said window;
- and applying a radiation-sensitive layer to at least said exposed surface portion of said electrode.
A method of making a camera tube having an envelope with a target assembly at one end and means arranged in the opposite end of said envelope for producing an electron beam for scanning the target, said method comprising the steps of:
- forming an integrated circuit for processing electrical signals in a peripheral portion of a semiconductor plate;
- providing, on a central portion of one side of said plate, at least one electrode which is permeable to incident radiation and which is connected to an input of said integrated circuit;
- providing, on a peripheral portion of said plate, at least one conductive layer which is connected to an output of said integrated circuit;
- and
- securing, in a vacuum tight manner, an annular, electrically insulating support to the other side of said plate;
- and then, in the following order:
- securing a window permeable to said radiation to said one side of said plate over said electrode in a manner such that the edge of said window extends at least up to the inner edge of said annular support and said conductive layer extends beyond said window;
- removing material from the central portion of the other side of said plate to expose a portion of the surface of said electrode remote from said window;
- applying a radiation sensitive layer to at least the exposed surface portion of said electrode to thereby form said target assembly;
- and
- securing said target assembly to said one end of said envelope.
Dependencies are inferred from the claim text.