Fabrication of integrated circuits utilizing thick high-resolution patterns

A method of processing nonplanar surface portions of a structure in a high-resolution way with good linewidth control, said method comprising utilizing a relatively thin uniform-thickness layer (20) of material and establishing a pattern therein definitive of the pattern in accordance with which the surface of said structure is to be processed, said relatively thin layer being insufficient by itself to provide step coverage and a uniform thickness layer if said relatively thin layer were applied directly on the nonplanar surface, characterized in that said method comprises

• prior to depositing and patterning said relatively thin layer, forming a relatively thick sacrificial layer (18) of material on the nonplanar surface of said structure, said sacrificial layer exhibiting a conforming lower surface and an essentially planar upper surface, said relatively thin layer being deposited on said essentially planar surface,
• processing said relatively thick layer employing the relatively thin patterned layer as a mask to form in said relatively thick layer a pattern having near-vertical walls and substantially no undercutting, said near-vertical walls extending through the entire thickness of said relatively thick layer, which pattern in said relatively thick layer corresponds substantially exactly to the pattern in said relatively thin layer,
• processing the surface of said structure utilizing said relatively thick patterned layer as a mask therefore, and removing said relatively thick patterned layer from the surface of said structure after the surface has been processed.