Laser-configured logic array

A process for forming a logic circuit device comprising the steps of:

• (a) providing a semiconductor substrate which contains a plurality of logic elements from which a logic circuit device is to be formed, each logic element containing a plurality of semiconductor elements together with intraelement semiconductor and metallization connection paths to be selectively interconnected with one another to define a prescribed function logic element, and interconnection pathways by way of which said logic elements are connected together to thereby provide any one of a plurality of diverse logic operations;
• and
• (b) selectively directing electromagnetic energy at prescribed portions of selected ones of said logic elements so as to disconnect selected portions of said semiconductor connection paths and to interconnect selected portions of said metallization connection paths to selected semiconductor material of said logic elements, thereby changing the transfer function originally defined by said selected ones of said logic elements and causing said logic circuit device to provide one of said plurality of logic operations.

An integrated circuit comprising:

• a semiconductor substrate which contains a plurality of logic cells from which the integrated circuit is formed, each logic cell containing a plurality of semiconductor elements together with intracell semiconductor and metallization connection paths, and interconnection pathways by way of which prescribed ones of said logic cells are connected together,
• prescribed portions of selected ones of said logic cells having been altered by the impingement of electromagnetic energy thereon with selected portions of said semiconductor connection paths having been disconnected and selected portions of said metallization connection paths having been interconnected to selected semiconductor material of said cells to define the transfer function of said selected ones of said logic cells, and
• selected ones of said interconnection pathways having been interconnected to thereby selectively interconnect logic cells among said plurality, including said selected ones of said logic cells.

A logic circuit device comprising:

• a semiconductor substrate which contains a plurality of logic elements from which the logic circuit device is formed, each logic element containing a plurality of semiconductor elements together with intraelement semiconductor and metallization connection paths, and interconnection pathways by way of which said logic elements are connected together, and
• prescribed portions of selected ones of said logic elements having been altered by the impingement of electromagnetic energy thereon with selected portions of said semiconductor connection paths having been disconnected and selected portions of said metallization connection paths having been interconnected to selected semiconductor material of said logic elements to define the transfer function of said selected ones of said logic elements to cause said logic circuit device to perform a specified logic operation.