Multi-spectrum photodiode devices
AssigneeRecognition Equipment Incorporated
InventorWilliam N. Carr
Life of this patent
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Abstract
One or more photoelectric device elements are formed beneath the surface of a monolithic semiconductor structure below a surface photoelectric detector device to form a plurality of photoelectric devices having different spectral responses. The surface element is responsive to visible light and the one or more subsurface devices are sensitive to longer wavelength radiation depending upon the depth of the device below the surface of the structure. A two dimensional array of the devices may be formed in a single semiconductor wafer to provide a self-scanning multi-element photosensor array.
Claims6
A multi-spectrum photodiode device having at least one photodiode pair, each photodiode of the pair operable independent of the other and sensitive to a different wavelength of radiation comprising:
- a body of semiconductor material of one conductivity type having an epitaxial layer of the same conductivity type on one face thereon;
- a diffused region of an opposite conductivity type in said body of semiconductor material at said one face under said epitaxial layer and forming a first photodiode therewith, a second diffused region of said opposite conductivity type in said epitaxial layer and forming a second photodiode therewith, said second photodiode being directly over but spaced apart from said first photodiode, a third diffused region of said opposite conductivity type in said epitaxial layer, extending through said layer to said first diffused region and providing contact thereto;
- and contact to said second diffused region to facilitate output from said second photodiode independent of the output from said first photodiode.
A photodiode device comprising a plurality of vertically aligned photodiodes, one photodiode being formed at the surface of a semiconductor chip and the other of said plurality of vertically aligned photodiodes being found one under the other within the body of the semiconductor chip, each of the photodiodes producing an output independent of the other through contacts and conducting regions extending into the body of the semiconductor chip to each of said photodiodes.
Dependencies are inferred from the claim text.