Method for mounting devices on a substrate

A method of automatically mounting on a supporting substrate, integrated circuit devices of different types and categories having external conductors, said method comprising the steps of:

• (A) defining a first reference system on the substrate, said first reference system including a plurality of positions, at which the devices are to be attached to the substrate;
• said devices being of first and second different types, according to their intended operation;
• said first and said second devices being mounted on corresponding first and second supporting elements;
• (B) selecting an appropriate device to be attached at each of said plurality of positions;
• (C) disposing said devices at different stations wherein at each station the devices are connected to a supporting element through their external conductors;
• (D) defining a second reference system independent of said first reference system, said second reference system including at least at first reference line and a plurality of stations at which the devices are disposed before they are mounted upon the substrate;
• (E) imparting relative movement between said first reference system of the substrate and said second reference system to align each position on the substrate with a corresponding station and a corresponding device disposed thereon;
• (F) separating each of said selected device from its said supporting element at the corresponding station by positioning first and second cutting tools along said first reference line and selectively actuating said cutting tools for cutting said devices from their supports such that each said selected device is cut from its said supporting element at the corresponding position at which the first and second devices are to be attached to the substrate;
• (G) disposing each said device on its corresponding substrate at said position;
• and
• (H) attaching each device to the substrate at the position to which the device has been aligned.