Semiconductor package with improved conduction cooling structure
AssigneeInternational Business Machines Corporation
InventorsDemetrios Balderes, John R. Lynch, Robert A. Yacavonis
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Abstract
A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.
Claims1
In a semiconductor device package having a substrate, at least one semiconductor device mounted on the top surface of the substrate, a heat sink having a surface in spaced relation to the top surface of the substrate, the improvement comprising,
- at least one heat transfer member positioned between said device and said surface of said heat sink,
- said heat transfer member comprised of a porous block of material, and
- a heat conductive non-volatile low viscosity, high surface tension, liquid permanently retained within said block of material and in contact with said device by capillary action,
- said heat transfer member operative to transfer heat by conduction from said device to said heat sink without changing phase.
Dependencies are inferred from the claim text.