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US 4,233,413 AGranted
Resin composition with low shrinkage
AssigneeHitachi Chemical Company, Ltd.
InventorsNoboru Monma, Iwao Maekawa, Tutomu Sarudate, Hidetaka Sato, Isao Uchigasaki
Life of this patent
Estimating the term…
Abstract
A resin composition comprising (A) 25 to 45 parts by weight of an unsaturated polyester having special structure, (B) 40 to 60 parts by weight of polymerizable monomer such as styrene, and (C) 4.5 to 15 parts by weight of a polystyrene, has low shrink properties and excellent electrical properties when molded, particularly by casting.
Claims11
A resin composition having low shrink properties which comprises
- (A) 25 to 45 parts by weight of an unsaturated polyester containing tricyclo(5,2,1,0.sup.2,6)dec-4-el-8 or 9-yl groups, alpha, betaunsaturated dibasic acid residues, and glycol residues as structural units, said unsaturated polyester being obtained by reacting, in equimolar amounts, dicyclopentadiene with an alpha, beta-unsaturated dibasic acid or by reacting, in equimolar amounts, dicyclopentadiene with an alpha, beta-unsaturated dibasic acid anhydride and water at 150.degree. C. or lower to yield a partially esterified dicyclopentadienecarboxylic acid, which is further reacted with at least one polyhydric alcohol.
- (B) to 40 to 60 parts by weight of one or more polymerizable monomoers having one or more polymerizable double bonds in the molecule, and
- (C) 4.5 to 15 parts by weight of a polystyrene.
Dependencies are inferred from the claim text.