High temperature-resistant conductive adhesive and method employing same
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorJoseph M. Shaheen
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Abstract
A high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.
Claims5
A method for bonding a semiconductor die to a substrate which comprises applying to the substrate a film of an adhesive formulation comprising an alloy of gallium-tin eutectic and gold dispersed in a solution of a polyimide resin;
- positioning a semiconductor die in contact with the film;
- pressing the die firmly in place;
- and curing the adhesive formulation to a solid bond material.
A high temperature-resistant, conductive adhesive composition comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.
The composition according to claimm 4 which comprises 48.5 weight percent eutectic, 48.5 weight percent gold and 3 weight percent polyimide resin.
Dependencies are inferred from the claim text.