Integrated circuit lead coupling device and method

A method for coupling leads to integrated circuit packages comprising the steps of:

• (i) providing a lead frame rail member comprising a plurality of resilient leads coupled to a first rail and a plurality of resilient leads coupled to a second rail, said first rail coupled to said second rail such that leads of said first rail are separated from and oppose said leads of said second rail;
• (ii) spreading the leads of each said rail away from the opposing leads of the other rail;
• (iii) placing coupling material within the area between said opposing leads and adjacent said leads;
• (iv) placing an integrated circuit package between said opposing leads at intervals along the length of said lead frame rail member;
• (v) releasing said leads whereby a plurality of said leads resiliently engage said coupling material and thereby clamp said coupling material between said leads and said package;
• and
• (vi) affixing said leads to said integrated circuit package by means of said coupling material.

A device for coupling leads to integrated circuit packages utilizing lead frame rail members, said rail members having a plurality of resilient leads attached to a first rail and a plurality of resilient leads attached to a second rail, said first rail attached to said second rail such that leads of said first rail are separated from and oppose said leads of said second rail, said device comprising:

• (i) a main frame;
• (ii) spreading means coupled to said main frame and selectively engaging said leads for spreading said leads of each said rail away from the opposing leads of the other rail such that an integrated circuit package can be inserted between said opposing leads at intervals along the length of said lead frame rail member;
• (iii) insertion means coupled to said main frame for inserting coupling material between said integrated circuit packages and said leads;
• and
• (iv) releasing means coupled to said main frame for releasing said leads of each said rail member such that said leads resiliently engage said coupling material and thereby clamp said coupling material between said leads and said package.

A device for coupling leads to integrated circuit packages utilizing lead frame rail members, said rail members having a plurality of resilient leads attached to a first rail and a plurality of resilient leads attached to a second rail, said first rail attached to said second rail such that leads of said first rail are separated from and oppose said leads of said second rail, said device comprising:

• (i) a main frame;
• (ii) spreading means coupled to said main frame and selectively engaging said leads for spreading said leads of each said rail away from the opposing leads of the other rail such that an integrated circuit package can be inserted between said opposing leads at intervals along the length of said lead frame rail member;
• and
• (iii) releasing means coupled to said main frame for releasing said leads of each said rail member such that said leads resiliently engage each said integrated circuit package.

A lead frame rail member for use in coupling leads to a plurality of integrated circuit packages comprising:

• (i) a first rail;
• (ii) a second rail coupled to said first rail, said first and second rails at least as long as two said integrated circuit packages;
• and
• (iii) a plurality of resilient leads coupled to said first and second rails such that leads of said first rail are separated from and oppose said leads of said second rail, whereby at least two integrated circuit packages can be placed along the length of said first and second rails between said resilient leads said resilient leads bearing upon said packages by the resiliency of said leads.