Process of defining film patterns on microelectronic substrates by air abrading

A process for delineating a pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising:

• forming a substantially continuous film coating of antimony doped tin oxide on the substrate, said film coating having a thickness between about 50 microinches and about 250 microinches;
• integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to said antimony doped tin oxide;
• selectively etching said mask film to generate a mask to form mask and unmasked portions on said film coating corresponding to the desired pattern;
• and
• air abrading the film coating with air abrading particles having a particle size of from about 10 microns to about 25 microns, said particles being propelled by an air pressure source of approximately 50 psi gauge, thereby leaving the masked portions of said film remaining on the substrate and removing the unmasked portions of said film.

A process for delineating a pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising:

• forming a substantially continuous film coating of antimony doped tin oxide on the substrate;
• integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to said antimony doped tin oxide;
• selectively etching said mask film to generate a mask to form masked and unmasked portions on said film coating corresponding to the desired pattern;
• air abrading the film coating, thereby leaving the masked portions of said film coating remaining on the substrate and removing the unmasked portions of said film;
• and
• selectively removing said mask from said film coating to form areas of conduction within said mask on said film coating.