Method for making a raw board for use in printed circuits
AssigneeNippon Mining Co., Ltd.
InventorsYoshio Kawasumi, Haruki Sato
Life of this patent
Estimating the term…
Abstract
A method for preparing a raw board for use in printed circuits comprising the steps of first electroplating a foil or sheet of synthesized resins in an electrolytic bath containing copper sulfate, sulfuric acid, chlorine ion and a surface glazing agent including thiourea, and secondly electroplating the foil or sheet completed the above step in a conventional electrolytic bath containing copper sulfate and sulfuric acid. Also, an apparatus therefor is disclosed.
Claims9
A method for preparing a raw board for use in printed circuits comprising the steps of:
- (A) depositing copper layer onto a film or sheet of synthesized resins;
- (B) subjecting said copper-deposited film or sheet to an electrochemical treatment at a temperature between 40.degree. C. and 90.degree. C. with a first electroplating bath containing copper sulfate, sulfuric acid, chlorine ion and a surface glazing agent including thiourea;
- and
- (C) subjecting thereafter the film or sheet to an electrochemical treatment with a second electroplating bath containing copper sulfate and sulfuric acid.
A method for making a fllexible laminate of plastic and copper for use in printed circuits, comprising:
- (a) subjecting a flexible plastic film to vapor deposition with copper so as to vapor-deposit a first layer of copper directly onto the surface of said film,
- (b) immersing said film and first copper layer into a first electroplating bath including a brightener as an additive, said bath being as a temperature of about 40.degree. C. to 90.degree. C., and plating a second layer onto said first copper layer;
- and
- (c) subjecting thereafter the film to an electrochemical treatment with a second electroplating bath containing copper sulfate and sulfuric acid.
A method for making a raw board for use in printed circuits, comprising the steps of (a) subjecting a very long film of a flexible plastic which can be easily rolled in a roll form to vapor deposition with a metal so as to vapor-deposit the metal directly onto the surface of the flexible film, (b) continuously immersing the flexible film in an electrochemical bath including as an additive a brightener which has its brightening effect only at a temperature between about 15.degree. C. to 30.degree. C., said bath being kept at a temperature between about 40.degree.-90.degree. C. where said brightner has no brightening effect so that a metal is continuously electroplated on the surface of the metal previously vapor-deposited on the surface of the flexible film, and (c) subjecting thereafter the film to an electrochemical treatment with a second electrochemical bath containing copper sulfate and sulfuric acid.
A method for preparing a raw board for use in printed circuits comprising the steps of:
- (a) continuously feeding a copper-deposited long film of snythesized resins as a cathode;
- (b) guiding the film along at least a pair of anodes;
- (c) subjecting thereby the film to an electrochemical treatment at 40.degree.-90.degree. C. with a first electrolytic bath containing copper sulfate, sulfuric acid, chlorine ion and glazing agent including thiourea;
- (d) guiding thereafter the film above said first electrolytic bath;
- (e) transferring the film along another pair of anodes;
- and
- (f) subjecting thereby said film to a second electrochemical treatment with a second electrolytic bath containing copper sulfate and sulfuric acid.
Dependencies are inferred from the claim text.